![]() Removing a load breaks its association with the rigging. Immersing the encapsulated component in this material will also soften the encapsulant the same as Methylene Chloride and of course, it will also attack and destroy any embedded epoxy devices. You can remove loads from rigging objects in the model and in schematic views. ![]() There has been some success reported in using the commonly available paint stripper sold under the trade name Circa 1867. Unfortunately, since printed circuit boards and many electronic components are also encapsulated with epoxy, they will also be damaged or destroyed by this solvent. Methylene Chloride will cause the encapsulant to swell and become soft for removal. #REMOVING ELEMENTS ON POLYTOOL SKIN#The user must take all precautions to prevent contact with skin and not to inhale the vapours while using this product. This solvent is hard to obtain as it has been declared a carcinogen. The other method is to immerse the encapsulated component in Methylene Chloride. Ensure to wear an appropriate face mask and good ventilation while removing the encapsulant when using this method. Epoxies and polyurethanes will smoke and give off odours when heated to high temperatures. Sdim: to toggle between poly Area, length and segment length. ![]() This method is more convenient for recovering heavier solid components than reclaiming delicate electronic circuits. Keyboard Command: Adim: to add dimensions to existing polyline ( Area, Length or perimeter) Cpoly: to convert Arc, line to polyline and join polylines. At this point the encapsulant will be soft enough to cut or penetrate with a chisel like device and break it away from the embedded component. The easiest method to remove epoxy or polyurethane is to heat it above its glass transition (softening point) temperature. In certain instances however, where the embedded component is reusable, such as an encapsulated conductor, it is worth while to remove the encapsulant and reclaim the embedded part. ![]() At best it is difficult to remove cured material without damaging the encapsulated components. ![]()
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